The AMB (Active Metal Brazing) process utilizes a small amount of active elements (for example, titanium Ti) contained in the brazing material to react with the ceramic to form a reactive layer that can be wetted by the liquid brazing material, thereby realizing the ceramic-metal bonding a method.

AMB-AlN ceramic copper clad laminate has the characteristics of high thermal conductivity, high insulation, high thermal capacity and thermal expansion coefficient matching the chip. It is an indispensable packaging material in the power semiconductor industry. Mainly used in: rail transit, intelligent power transmission, electric vehicles, high-end white goods and high-end refrigerator industries.